Processor Type:Microprocessor
Memory Capacity:Up to 2 MB
Operating Voltage:3 AC 500-575V, 50/60Hz
Communication Interface:Profinet IF, Profibus DP Master/Slave IF
Protection Rating:IP65/67
Working Temperature:-10°C to +50°C
Dimensions:144 x 144 mm
Weight:Approximately 1.5 kg
The Siemens 6SE7090-0XX84-0AA1 CU1 Microprocessor Board is a cornerstone of Siemens’ SIMOVERT MASTERDRIVES family, offering cutting-edge technology for precise control in demanding industrial environments. This microprocessor board is engineered with a focus on efficiency and ease of integration into existing systems, ensuring seamless operation alongside other Siemens automation components.
Featuring a robust microprocessor architecture, this board supports a vast array of control protocols and communication interfaces, including Profinet and Profibus DP, facilitating its use in complex, multi-vendor automation setups. Its extensive memory capacity enables sophisticated control algorithms and data processing capabilities, enhancing system performance and responsiveness.
With its IP65/67 protection rating, the 6SE7090-0XX84-0AA1 CU1 Microprocessor Board is designed to withstand harsh industrial conditions, from dusty environments to water splashes, ensuring reliable operation in diverse industrial settings. The wide operating temperature range (-10°C to +50°C) guarantees consistent performance across various geographical locations and seasons.
The compact dimensions and moderate weight make installation and maintenance straightforward, minimizing downtime and simplifying the setup process. Moreover, the compatibility with Siemens’ comprehensive ecosystem of automation products ensures a streamlined approach to system design and integration, optimizing productivity and cost-efficiency.
For users seeking a reliable, high-performance microprocessor board to enhance their industrial automation systems, the Siemens 6SE7090-0XX84-0AA1 CU1 Microprocessor Board delivers exceptional value with its combination of advanced features, robust construction, and seamless integration capabilities.
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